| 摘要 |
<p>PURPOSE:To dispense with the use of magnets and the like for preventing a deposition material from depositing on the deposition surface of a wafer substrate and to prevent the failure of the substrate at the time of attachment and, detachment of the substrate by a method wherein a magnetic material, from which a prescribed adsorbability is obtained and which has an area, is formed on one surface of the wafer substrate and the substrate is fixed on a support plate with magnets installed on its rear by an adsobability due to a magnetic force of the prescribed adsorbability with the magnets. CONSTITUTION:A magnetic material (such as titanium, chrome, nickel or the like) 2 is deposited on a wafer substrate 1. The substrate 1 with this material 2 deposited thereon is fixed on a support plate 7 by magnets 3 installed on the rear of the plate 7, an electrode formation deposition treatment is executed and the material 2 which becomes unnecessary is removed by a chemical treatment and polishing in the final working process. Even if the above embodiment is performed by a method of a plating treatment, application or the like as a method of making the material 2 adhere on the substrate 1, an effect equal with that in the above embodiment is obtained. Moreover, even if the plate 7 itself is the magnets 3, the effect equal with that in the above embodiment is obtained.</p> |
