发明名称 PRINTED WIRING BOARD
摘要 PURPOSE:To obtain a printed wiring board which is composed of boards joined together with solder and high in reliability by a method wherein a first board is provided with a through-hole into which a conductor pin is inserted, and a second board provided with a solder filling hole whose diameter is larger than that of the through-hole and which is located above the through-hole. CONSTITUTION:A printed wiring board is composed of a first board 1 and a second board 2, and the first board 1 is provided with a through-hole 30 into which a conductor pin 5 is inserted. The second board 2 is provided with a solder filling hole 20 whose diameter is larger than that of the through-hole 30 and which is located above the through-hole 30. The head 51 of the conductor pin 5 is inserted into the through-hole 30, and a collar 52 is provided to the conductor pin 5 so as to bear on a land 311. The inner wall of the through-hole 30 is coated with a plating layer 32. The plating layer 32 is electrically connected to the land 311 on the front of the board 1 and a land 312 on the rear.
申请公布号 JPH03145791(A) 申请公布日期 1991.06.20
申请号 JP19890285337 申请日期 1989.10.31
申请人 IBIDEN CO LTD 发明人 IZUMI KOICHI;HAYASHI TAKASHI
分类号 H05K1/18;H05K3/34;H05K3/42 主分类号 H05K1/18
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