| 摘要 |
PURPOSE:To obtain a semiconductor device which is excellent in moisture resistance and adhesion to a bonding wire and a semiconductor substrate or a stabilized film such as a silicon dioxide film by a method wherein a protective layer of specific polyimide resin is formed. CONSTITUTION:A semiconductor pellet 1 is fixed to the tip of a tab lead 7, the electrode of an element is bonded to a lead wire with a wire 5 of gold or the like, the surface of the semiconductor pellet 1 is coated with a polyimide resin 6 of undercoating resin for protection, and then the semiconductor pellet 1 is sealed up with a sealing resin 8 including the tip of the tab lead 7. Polyimide resin concerned is formed in such a manner that aromatic tetracarboxylic acid containing 95mol% or more 3,3',4,4'-benzophenone tetracarboxylic acid is reacted with diamine which contains 90mol% aromatic diamine represented by formulas I and II. In formulas, X denotes CH2, O, SO2, C(CH3)2, C(CF3)2 or S, R<1> and R<2> represent CH3 and C2H5 or a low alkoxyl group, R<3> and R<4> are C2H5, and R<5> denotes benzene nucleus or cyclohexane nucleus. |
