METHOD AND METALLIC MOLD FOR MOLDING PLASTIC MOLDED TYPE SEMICONDUCTOR ELEMENT,申请号JP19890282446-传众专利搜索

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发明名称	METHOD AND METALLIC MOLD FOR MOLDING PLASTIC MOLDED TYPE SEMICONDUCTOR ELEMENT
摘要
申请公布号	JPH03142939(A)	申请公布日期	1991.06.18
申请号	JP19890282446	申请日期	1989.10.30
申请人	FUJI ELECTRIC CO LTD	发明人	NOMOTO TAKAYASU;NUKII YOUICHI
分类号	H01L21/56	主分类号	H01L21/56
代理机构		代理人
主权项
地址

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