发明名称 |
Method for preparing a substrate surface for bonding with a synthetic resin by applying a layer by sand blasting |
摘要 |
The present invention relates to a method for preparing a surface for bonding with a synthetic resin. In the method, a layer is applied onto a substrate surface by sand blasting with a composition comprising (A) 0.01 to 90% by weight of an optionally silanized material having a particle size less than 5 mu m and having a hardness greater than that of the substrate surface, and/or (B) 20 to 100% by weight of a silanized siliceous material having an average particle size of 2 to 200 mu m, and (C) the remainder of the sand blasting composition having an average particle size greater than 5 mu m, and optionally the layer is thereafter silanized. The invention is further directed to the above-mentioned composition.
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申请公布号 |
US5024711(A) |
申请公布日期 |
1991.06.18 |
申请号 |
US19890301019 |
申请日期 |
1989.01.24 |
申请人 |
THERA |
发明人 |
GASSER, OSWALD;GUGGENBERGER, RAINER;BURGER, BERND |
分类号 |
A61C5/08;A61C5/10;A61C13/00;A61C13/08;A61K6/00;A61K6/027;A61K6/04;B05D7/14;B29C65/00;C09J5/02 |
主分类号 |
A61C5/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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