| 摘要 |
PURPOSE:To increase safety of an operation by a method wherein a supply of pure water is changed over, by using a three-way valve, to a pure-water spraying port for wafer cleaning use at a treatment and to a pure-water spraying port for chamber cleaning at a non-treatment so that a chemical liquid adhering to a wall face or the bottom of a treatment chamber can be cleaned by using the pure water. CONSTITUTION:Pure water which is supplied from an input valve 9 is changed over, by using a three-way valve 8, to a pure-water spraying port 4 for wafer cleaning or to a pure-water spraying port 7 for chamber cleaning; as a result of this changeover, the pure water is returned to the input valve 9 as shown by a dotted line, and its flow rate is adjusted. When the valve is changed over to the pure-water spraying port 4 for wafer cleaning use, a prescribed flow rate for wafer cleaning is set; when the valve is changed over to the pure-water spraying port 7 for chamber cleaning, a required minimum flow rate is set in such a way that the pure water must always flow to an apparatus in order to keep a purity of the pure water. A gradient toward the lower part at the inside from a vertical face is formed at sidewalls of a treatment chamber 1. |
