| 摘要 |
In a device having flexible, stripline conductors surrounded by a dielectric and ground planes, a conductor laminate (1) comprising a substrate (1) and conductors etched on one of its surfaces and windows cut between the conductors and a ground plane laminate comprising a substrate cut essentially similarly to the substrate of the conductor laminate with somewhat larger dimensions and a copper foil arranged on one of the sides of the substrate are adhesively bonded to each other with the conductors of the conductor laminate engaged with that side of the substrate of the ground plane laminate which is not covered by a foil. A metallization is provided on the side of the device which is opposite to the foil covered surface of the ground plane laminate. This metallization is electrically connected to said foil covered surface such that conductors and substrates are completely enclosed by an electrically conducting layer. |
