CAPACITE INTEGREE DANS UN CIRCUIT HYPERFREQUENCE

摘要

The invention relates to a capacitor, produced from a metallised hole in the dielectric substrate of a microwave circuit. Microwave circuits are frequently produced on a dielectric substrate 1 which includes, on its rear face, an earth plane 4. The microwave circuit is connected to the earth plane 4 by metallised holes 2 + 5. A capacitor is formed from the pellet 6 surrounding the metallised hole 2 + 5: a dielectric layer 7 is deposited on this pellet 6, then a second metal layer 8, which is connected by an air bridge 10 to one track of the circuit 12. The second metal layer 8 is continuous and forms a plug 9 for the hole 2 + 5. Application to microwave circuits and to their sealed encapsulation.