| 摘要 |
<p>PURPOSE:To divide dust into small pieces and to prevent the contact of the dust to wire lines by providing slit patterns on the periphery of a process pat tern together with an original pattern, and partially removing a material consti tuting the process pattern. CONSTITUTION:A process pattern 8 is formed within a dicing line 6 between chips 2 and 4. An original pattern 10 is provided at the central part of the process pattern 8. A peripheral region 12 comprising a material such as Al and PSG spreads around the original pattern 10. A plurality of strip-shaped slit patterns 14 are arranged. Various kinds of the materials on the peripheral region 12 are partially removed with the slit patterns 14. When scribing is performed along the dicing line 6, the process pattern 8 is cut, and dust is divided into small piece. Part of the dust is attached to the cut surfaces as remnant 18. The length of the dust piece is short, and the dust piece is not in contact with a pad 26 and a wire line 28 which is bonded on the pad 26.</p> |
