发明名称 WIRE BONDING METHOD AND EQUIPMENT
摘要 PURPOSE:To shorten the time, required for switching of the type of bonding, and improve the availability of a wire bonder, by pressing a lead to be bonded with the retaining part of a retaining arm driven in the XY-direction and vertical direction. CONSTITUTION:Two lead retainers 20A, 20B are arranged on both sides of a bonding head 11. When a wire 14a is connected with an electrode 1a1 and a lead 2a1 in a region 23A, according to data previously programmed in a computer, the lead retainer 20A is driven in the XY-direction and a retaining arm 22A is drive in the vertical direction. Thereby a lead part which is at a distant from a bonding point of the lead 2a is pressed by a retaining part 22a. In this state, a tool 13 is driven in the XY-direction and the vertical direction, and a wire 14 inserted into the tool 13 is donded. Hence the time, required for switching of the type of bonding, can be remarkably shortened by previously programming in a computer the moving position of the retaining part 22a according to type of bonding.
申请公布号 JPH03136340(A) 申请公布日期 1991.06.11
申请号 JP19890275157 申请日期 1989.10.23
申请人 SHINKAWA LTD 发明人 YAMAZAKI NOBUHITO
分类号 H01L21/60;H01L21/00;H01L21/68;H05K13/06 主分类号 H01L21/60
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