发明名称 RESIN COMPOSITION FOR MOLDING
摘要 PURPOSE:To obtain a composition having high mechanical strength, abrasion resistance and chemical resistance and excellent moldability by compounding a specific polymer to a mixture of a polyamide resin and a thermoplastic polyester resin. CONSTITUTION:The objective composition is produced by compounding (A) 70-99.5 wt.% of a resin mixture composed of 5-95 wt.% of a polyamide resin and 95-5 wt.% of a thermoplastic polyester resin with (B) 0.5-30 wt.% of a polymer produced by polymerizing 80-98 wt.% of an aromatic vinyl compound (e.g. styrene), 19-1 wt.% of an alpha, beta-unsaturated carboxylic acid compound (e.g. acrylic acid or maleic acid) and 19-1 wt.% of an unsaturated epoxy compound (e.g. glycidyl methacrylate). Furthermore, (C) 50-10 wt.% of glass fiber is mixed to 50-90 wt.% of the above resin mixture.
申请公布号 JPH03137157(A) 申请公布日期 1991.06.11
申请号 JP19890343724 申请日期 1989.12.27
申请人 DAICEL CHEM IND LTD 发明人 WATANABE ICHIJI;INOTSUKA AKIHIRO
分类号 C08K7/14;C08L25/04;C08L67/00;C08L67/02;C08L73/00;C08L77/00 主分类号 C08K7/14
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