| 摘要 |
PURPOSE:To prevent a defect which is caused during a resin sealing operation and to enhance reliability by a method wherein a sealing and bonding part is coated with an Si resin in a frame shape corresponding to a cap and the resin is hardened. CONSTITUTION:A semiconductor chip 2 is die-bonded to a cavity 1a in a package substrate 1 by using an adhesive 3; an electrode of the chip and an inner lead are wired by using a wire. A flat part of the cavity 1a in the substrate 1 is coated with an Si resin 10 in a frame shape; the resin is hardened. The Si resin 10 is coated with a sealing resin 11 whose bonding property is excellent. A cap 7 having a clearance hole for bolt insertion use is positioned; and it is fastened to the substrate 1 by using a bolt 13 and a nut 14. |
