发明名称 MANUFACTURE OF LAMINATED BOARD
摘要 <p>PURPOSE:To reduce warpage by superposing long-sized metallic foils onto the outer surfaces of a plurality of long-sized fluoroplastic-impregnated base materials, pressing and heating the whole while being made to travel, unifying the base materials and the metallic foils and cutting the unified base materials and metallic foils in specified size. CONSTITUTION:A long-sized metallic foil 20 is superposed onto at least one-side outer surface of a plurality of long-sized fluoroplastic-impregnated base materials 10, and the base materials 10 and the metallic foil 20 are pressed by a pair of upper and lower belts 41, 41 and heated while being made to travel and laminated and unified, and cut in specified size. The same base material as one for manufacturing a normal fluoroplastic laminated board is used as the fluoroplastic-impregnated base material 10. Various conductor metals or nonconductive metals can be employed as the metallic foil 20 in response to the usage object, etc., of a laminated board. Accordingly, the fluoroplastic laminated board having the low rate of warpage and excellent quality can be manufactured efficiently.</p>
申请公布号 JPH03130143(A) 申请公布日期 1991.06.03
申请号 JP19890270021 申请日期 1989.10.16
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 YOSHIMITSU TOKIO;IKOMA SUNAO
分类号 B32B15/082;B32B37/10;B32B43/00;H05K1/03;H05K3/02 主分类号 B32B15/082
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