发明名称 METHOD AND APPARATUS FOR THE RAPID DEPOSITION BY CHEMICAL VAPOR DEPOSITION WITH LOW VAPOR PRESSURE REACTANTS
摘要 <p>An apparatus for the coating of substrates using chemical vapor deposition in which low vapor pressure reactants are used comprising a powder feeder means (12) or atomizer feeder means (112) which is used to introduce the reactants into a chemical vapor deposition furnace (50); the entire apparatus being useful for coating substrate using chemical vapor deposition in which low vapor pressure reactants are used, comprising the steps of providing a substrate (52) and a quantity of one or more reagents, placing the substrate within the furnace, introducing the reactants into and reacting the reactants within the furnace resulting in the deposition of a coating consisting essentially of the reactant components on the substrate; said reagents generally chosen to yield the group of oxide superconductors.</p>
申请公布号 WO1991007236(A1) 申请公布日期 1991.05.30
申请号 US1990006792 申请日期 1990.11.20
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