| 摘要 |
PURPOSE:To maintain low noise performance and reduce cost by constituting a package which seals a pellet, a part of each lead, and wire by using a resin seal package. CONSTITUTION:The following are provided; a pellet 2, a plurality of leads 3 for electrically leading out 2DEG-field effect transistor(FET) circuit built in the pellet 2, wires 4 which are constituted in thin wire forms by using gold (Au) based material and bridged between an electrode pad of the pellet 2 and each lead 3, and a package 6 which is formed in a body by using epoxy system resin and non-hermertically seals the pellet 2, a part of each lead 3, and wires 4. By constituting the package 5 of a resin seal package in the above manner, cost is reduced and low noise performance can be maintained. |
