发明名称 |
COATING COMPOSITION FOR PHOTORESIST |
摘要 |
PURPOSE:To decrease the amt. of the fine particles to be generated by confining the content of a solid component having >=150 and <=400 mol. wt. to <=6wt.% of the total solid component exclusive of a solvent. CONSTITUTION:The content of the solid component having >=150 and <=400 mol. wt. of the coating compsn. for the photoresist consisting of a base resin, photosensitive agent and solvent is <=6wt.% of the total solid component. The result is better as the ratio of the component having the above-mentioned specific mol. wt. is lower. The generation of the sublimated fine particles is substantially prevented by the dilution effect of a low vapor pressure component if the above-mentioned content is <=6wt.% of the total solid component exclusive of the solvent in the coating compsn. for the photoresist. The sublimated matter is decreased in this way and the generation of the fine particles which are harmful for fine working is lessened. This compsn. is advantageous in production of very LSIs. |
申请公布号 |
JPH03125152(A) |
申请公布日期 |
1991.05.28 |
申请号 |
JP19890263410 |
申请日期 |
1989.10.09 |
申请人 |
MITSUBISHI ELECTRIC CORP;MITSUBISHI KASEI CORP |
发明人 |
UOTANI SHIGEO;ARIMOTO ICHIRO;NISHI MINEO;SAKAGUCHI MASAHIRO |
分类号 |
G03F7/004;G03F7/022;H01L21/027 |
主分类号 |
G03F7/004 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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