| 摘要 |
<p>PURPOSE: To conform a suction pipette to the inclined atate of a device by a method, wherein the suction pipette is formed by the material which can be deformed in an expandable/contractable manner in the aperture facing to the device. CONSTITUTION: When a hard rubber inserting material PE is provided on the lower end of the rigid metal case H of a pipette S, the one-side load of a device BE and a leg A are compensated accurately. A soft compensatory operation can be strengthened by adding a lip-like part which spread annularly. After setting a device BE on the soldering position of a printed board LP, a solder receiver LH is brought down, the leg A is pressed to a pad AP by the working surface of arcuate electrodes B1 and B2, and pressing force F1 is maintained through a pipette S. The solder of a pad is fused by the heat of resistance, inclination is completely removed, and the pipette conforms to this state. A solder layer of prescribed thickness can be formed by lifting a member LH, and and the pipette S is moved upward.</p> |
