发明名称 Method of making a semiconductor sensor having funnel-shaped apertures in the semiconductor substrate.
摘要 <p>A semiconductor sensor (20) with a compact structure is provided, which comprises a semiconductor substrate (21), a semiconductor diaphragm (23) integrally formed with the semiconductor substrate, and a penetrating aperture (27) formed in the semiconductor substrate so as to surround desired sides of the diaphragm. The aperture (27) has both a first funnel-shaped aperture (127) and a second funnel-shaped aperture (227) jointed to the first funnel-shaped aperture. A cavity (26) for defining the diaphragm (23) is provided when the semiconductor substrate (21) is subjected to electrolytic etching to form the second funnel-shaped aperture (227) therein.</p>
申请公布号 EP0428175(A1) 申请公布日期 1991.05.22
申请号 EP19900121916 申请日期 1990.11.15
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 HIRANO, HIROKAZU, C/O INTELLECTUAL PROPERTY DIV.;YAMAKI, BUNSHIRO, C/O INTELLECTUAL PROPERTY DIV.
分类号 G01P15/08;G01P15/12;H01L29/84 主分类号 G01P15/08
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