发明名称 |
Method of making a semiconductor sensor having funnel-shaped apertures in the semiconductor substrate. |
摘要 |
<p>A semiconductor sensor (20) with a compact structure is provided, which comprises a semiconductor substrate (21), a semiconductor diaphragm (23) integrally formed with the semiconductor substrate, and a penetrating aperture (27) formed in the semiconductor substrate so as to surround desired sides of the diaphragm. The aperture (27) has both a first funnel-shaped aperture (127) and a second funnel-shaped aperture (227) jointed to the first funnel-shaped aperture. A cavity (26) for defining the diaphragm (23) is provided when the semiconductor substrate (21) is subjected to electrolytic etching to form the second funnel-shaped aperture (227) therein.</p> |
申请公布号 |
EP0428175(A1) |
申请公布日期 |
1991.05.22 |
申请号 |
EP19900121916 |
申请日期 |
1990.11.15 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
HIRANO, HIROKAZU, C/O INTELLECTUAL PROPERTY DIV.;YAMAKI, BUNSHIRO, C/O INTELLECTUAL PROPERTY DIV. |
分类号 |
G01P15/08;G01P15/12;H01L29/84 |
主分类号 |
G01P15/08 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|