FILM MATERIAL FOR MANUFACTURING FILM CARRIER AND MANUFACTURE OF THE CARRIER

摘要

PURPOSE:To efficiently produce in a large quantity irrespective of electrode disposition of a semiconductor chip by pattern forming an outer lead part on a film material for a film carrier. CONSTITUTION:A semiconductor chip mounting lead pattern 20 is formed at the center on the surface of a film tape 10a, a conductor metal layer is formed on the whole surface of the tape 10a, and removed in a predetermined pattern by etching. Outer lead parts 21 extending in four directions, and a regular square-shaped inner lead forming part 23 disposed at the center of the parts 21 are provided. The part 23 is formed in a shape in which the entirety is integrally continued, a small regular square-shaped space 24 is formed at the center, thereby reducing a labor of forming the inner lead part.