发明名称 MANUFACTURE OF ALUMINUM NITRIDE SUBSTRATE
摘要 PURPOSE:To inhibit the increase in the resistance of a conductor line and form a flat substrate by clamping a circuit formation green sheet degreasing body with a green sheet degreasing body, placing a remedy sheet on the sheet, and performing baking. CONSTITUTION:A circuit formation green sheet degreasing body 1 is clamped with a single layer of green sheet degreasing body in the same shape from top and bottom and then placed on a BN setter 3 under the clamped state. The BN setter 3 is set into BN vessel 4. A remedy substrate 5 comprising BN is placed on the single layer green sheet degreasing body 2 on the upper side. The remedy substrate 5 serves to prevent the generation of camber produced during baking. Then, a BN-made cover is placed over the BN vessel 4 and the covered vessel is put into a sintering furnace and baked in a nonoxidizing atmosphere.
申请公布号 JPH03119784(A) 申请公布日期 1991.05.22
申请号 JP19890257493 申请日期 1989.10.02
申请人 FUJITSU LTD 发明人 OMOTE KOJI;YOKOYAMA HIROZO;TSUKADA MINEHARU
分类号 C04B35/581;C04B35/58;C04B35/64;H05K1/03;H05K1/09;H05K3/12 主分类号 C04B35/581
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