SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SYSTEM

摘要

An improved semiconductor device manufacturing system and method is disclosed in which undesirable sputtering can be averted by virtue of the combination of an ECR system and a CVD system. Prior to the deposition of a semiconductor layer by the ECR/CVD combination, a sub-layer can be formed on a substrate in a reaction chamber and transported to another chamber for deposition to be effected according to the ECR/CVD combination without the substrate being exposed to contact with air, so that a semiconductor junction thus formed has good characteristics.