| 摘要 |
<p>PURPOSE:To improve defective package caused by high density and fining by providing a Cu-based second thick film conductor which is electrically short- circuited to a first thick film conductor and by realizing a structure which electrically short-circuits the first thick film conductor and a chip part by anisotropic conductive resin. CONSTITUTION:A first thick film conductor 12 which consists of an Ag-Pd thick film is printed and dried on an alumina substrate 11. After an insulating layer 13 is further printed and dried, it is burned. Then, after a Cu thick film 14 is printed and dried, it is burned. The first thick film conductor Ag-Pd thick film 12 and the Cu thick film 14 are electrically connected through a via hole 13a which is provided to the insulating layer 13. A protective resin 15 is printed and dried. Cream solder is printed, a chip part such as chip resistance and a chip capacitor is mounted, and soldering is carried out. Then, anisotropic conductive adhesive 16 is printed and resin mold IC17 is bonded and dry- hardened. Metal elements in the anisotropic conductive adhesive 16 combine each other to allow resin mold IC terminals 17a, 17b and the first thick film conductor 12 to electrically short-circuit independently.</p> |
