| 摘要 |
<p>PURPOSE:To prevent a semiconductor device from deteriorating in circuit function and to avoid wire disconnection by a method wherein the semiconductor element and the wire are sealed up with at least one type of organic resin material. CONSTITUTION:A semiconductor device is composed of a base 1, a semiconductor element 2, a lead frame 4, a spacer 5, a ceramic lid 6, and a wire 8. At least one type of an organic resin material 10 is filled up seal up the semiconductor element 2 and the wire 8. Therefore, even if water vapor penetrates into the semiconductor device due to the poor adhesion between the aluminum nitride base 1 and an adhesive agent 3, the semiconductor element 2 and the wire 8 are protected by the organic resin material 10 as potted, so that they are free of the adverse effect of water vapor or the like. By this setup, a semiconductor device of this design can be prevented from deteriorating in circuit function and wire disconnection is avoided.</p> |
