| 摘要 |
<p>This invention relates to a plating method consisting of the steps of placing a solid phase plating metal in the vicinity of an object surface of a metal plate being fed, melting the plating metal as much a quantity as is required for plating the object surface, and depositing the molten plating metal in the form of a film on the object metal plate surface. According to this plating method, a molten metal bath is not required at all, and a plating film using molten metal can be obtained without troubling an operator about various problems arising from a plating operation using a molten metal bath.</p> |
