| 摘要 |
<p>A system for the assembly and connection of electronic circuits formed on a plurality of substrates or boards (9) of identical size is described. Each board (9) is mounted in a respective module (M) between two elements (7, 8) of resilient, electrically-insulating material. The terminals of each board (9) are connected to one or more multicore ribbon cables (14) clamped between the resilient elements (7, 8). The modules (M) are arranged next to each other in sequence and are clamped by means of tie bolts (6) so that the resilient elements (7, 8) are compressed to a predetermined extent. The pack of modules (M) thus formed is disposed in a housing (1, 2, 3), preferably of metal, carrying at least one multipole electrical connector (4) to which at least some of the cables (14) are connected so that the circuits carried by the boards (9) can be connected to external devices and/or circuits.</p> |
