发明名称 MANUFACTURE OF ONE SIDE COPPER-SPREAD LAMINATED BOARD AND MANUFACTURE OF ONE SIDE PRINTED-WIRING BOARD EMPLOYING LAMINATED BOARD THEREOF
摘要 <p>PURPOSE:To enable a process rationalization and obtain a remarkable cost reduction effect by putting symmetrically each other a constitutional body in which copper foil is superimposed on one side being placed with a predetermined sheet of prepregs and mold-release treated metallic foil is superimposed on the other side, and another constitutional body via a predeter mined sheet of prepregs and disposing mirror plates on the whole upper and lower position and heat-press molding them thereafter. CONSTITUTION:A constitutional body being superimposed with mold-release treated metallic foil 5, two sheets of prepregs 3, and further copper foil 2 are arranged on a prepreg 6. Another constitutional body is arranged symmetrically below the prepreg 6 and then the whole thereof is held by two mirrors 1. For the metallic foil 5, aluminum is most suitable in view of cutting workability and economical point. It is preferable to be in the range of 10 - 100 mum in the thickness of the metallic foil 5 and in the case of 10 mum or less, since the rigidity of the product is less, it is liable to cause rolling in the delivery rolls or dropping and the like during the circuit working period, on the other hand, in the case of 100 mum, the cutting workability becomes worse. In the releasing property between the prepregs 3 and the metallic foil 5 on one side board, it is preferred to be 10 -200 g/cm. The release property is possible such that a release agent is applied uniformly on the metallic foil 5 and the release property can be controlled by the amount of application.</p>
申请公布号 JPH03112656(A) 申请公布日期 1991.05.14
申请号 JP19890251448 申请日期 1989.09.27
申请人 HITACHI CHEM CO LTD 发明人 KATO HIDEO;SHINKO TOYOTARO;EDA TETSUO
分类号 B32B38/00;B32B37/10;B32B43/00;H05K3/00 主分类号 B32B38/00
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