| 摘要 |
PURPOSE:To prevent flow cracks from occurring due to steam pressure by separating an insulation member into a plurality of small pieces and by enabling steam generated inside of a package to the outside of the package by reflow heating. CONSTITUTION:A plurality of leads 3 are pulled out of two directions (longer surface) of a resin-sealed semiconductor device toward the outside and an insulation member 7 such as polyimide film is adhered to a part which is directly below a semiconductor element 1. This insulation member 7 is separated into a plurality of small pieces 7a, the small pieces 7a are not adhered to one another so that it is possible to enable steam generated inside the package when performing reflow heating to be escaped to the outside of the package through the lead 3, and pressure due to steam is not produced within the package, thus preventing reflow cracks from occurring. |
