| 摘要 |
PURPOSE:To enhance packaging density of semiconductor chips to a package by superposing a plurality of semiconductor chips mutually so that an electrode for external connection which are formed on the same surface may be exposed in the same surface direction. CONSTITUTION:Semiconductor chips 4 and 8 are mutually superposed so that electrodes 5 and 9 for external connection which are formed on the same plane in respective semiconductor chip 4 and 8 may be exposed in the same surface direction. Namely, all the electrodes for external connection 5 of the chip 4 are formed on the upper surface as the same surface, are exposed toward the upper side as the same surface direction, are placed at both edge parts on the upper surface of the chip 4 along the X-direction, and are connected to an inner lead 7 by a wire 6. Also, the electrode 9 for all the external connection of the chip 8 is formed on the upper surface as the same surface and are placed along the Y-direction. Thus, it is not covered by a die pad 3 and a chip 4 and are exposed toward the upper side as the same surface direction and are connected to the inner lead 7, thus enhancing the packaging density to the package 7.
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