PATTERN WRITING ON SUBSTRATE

摘要

PURPOSE: To provide a Cu pattern on a substrate by fixing a circuit channel on the dielectric layer of the substrate, removing that channel from the surface of the dielectric through micromachining after the precipitation of Cu and remaining Cu in the circuit channel. CONSTITUTION: A photosensitive polyimide component or a photosensitive epoxypolymer component is provided on the substrate of metal or glass. The pattern of the circuit channel cured by exposure and development is fixed. The thickness of the channel is about 10μ. Cu is stuck on all the surface thicker than channel depth by a known technique. Cu on the unwanted block except for the circuit channel is removed by microgrinding and while remaining Cu in the channel, the Cu pattern is formed on the substrate. Concerning the Cu layer, the strength of adhesion with a resin layer is increased when using Ti or Cr as a base layer. Thus, the pattern can be prepared on the substrate with remarkable satisfactory efficiency and cost reduction.