| 发明名称 |
MULTILAYER CIRCUIT BOARD HAVING MICROPOROUS LAYERS AND METHOD FOR MAKING SAME |
| 摘要 |
A microporous, photoprocessable, moderately hydrophilic material on which metal can be deposited directly using electroless plating techniques, and its use in preparing printed wiring boards and circuit components.
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| 申请公布号 |
CA2028710(A1) |
申请公布日期 |
1991.05.01 |
| 申请号 |
CA19902028710 |
申请日期 |
1990.10.29 |
| 申请人 |
FOXBORO COMPANY (THE) |
发明人 |
GRANDMONT, PAUL E.;LAKE, HAROLD;ANDERSON, RICHARD A. |
| 分类号 |
H05K3/40;H05K3/00;H05K3/18;H05K3/38;H05K3/46;(IPC1-7):H05K1/02 |
主分类号 |
H05K3/40 |
| 代理机构 |
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代理人 |
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