| 摘要 |
PURPOSE:To facilitate a wafer dicing cut and leave equal spacings between the elements of respective arrays by arranging the opening portions of light emitting portions facing chip end faces so as to be directed toward outside the chip end faces. CONSTITUTION:A light emitting element 14 includes a light emitting portion 12 formed at a given spacing (a) by a selective diffusion method and an electrode wiring 13 electrically connected to the upper and lower end portions 12a and 12b, respectively, of the light emitting portion 12 via a bridge portion 13a formed on one side face of the light emitting portion 12. In this case, the electrode wiring 13 with a U-shaped configuration encircles the light emitting portion 12 and the other side face thereof is opened to form an opening portion 13b. The light emitting portion 12 facing a chip end face is arranged so that the opening portion 13b is directed toward outside the chip end face. Thus, since the effect of the wiring width of the bridge portion is removed and a sufficient margin can be taken in dicing cut, a dicing is facilitated. |
