| 摘要 |
<p>PURPOSE:To enhance metal foil peeling strength, bending strength at the time of heating and Barcol hardness by interposing an epoxy modified polyimide prepreg between epoxy prepreg and a metal foil, and subjecting to lamination molding. CONSTITUTION:This laminated board is obtained by interposing prepreg 2 immersed with epoxy modified polyimide resin between prepreg 3 immersed with epoxy resin and a metal foil 1, and subjecting to lamination molding. Such a board largely improves its heat resistance, its pectinated resistance (particularly after moisture absorbing), metal foil adhesive strength at the time of heating, solder heat resistance, and also improves bending strength and Barcol hardness at the time of heating. Thus, for example, reliability as a surface mounting board can be improved.</p> |
