| 摘要 |
PURPOSE:To pack paste into viaholes without generating the chipping of veer and without generating the conduction between the viaholes by packing conduc tive paste by means of a squeegee into the unpacked parts of the viaholes in a specific mode to form pads, then forming the pads of the other surfaces. CONSTITUTION:A green sheet with a film formed with the viaholes is fixed to a 1st metallic mask and the paste is packed therein by means of the squee gee. A 2nd metallic mask is used for the green sheet after film peeling and the pads are formed in the upper part of the viahole. The pads are formed on the rear of the green sheet by the 1st metallic mask. The viaholes are formed on the green sheet with the film and the paste is packed from the film surface into the holes, by which the generation of the bleeding out of the paste atop the green sheet is obviated according to this viahole forming method. The metallic masks are used for the fixing jigs and water absorbent paper is not used and, therefore, the bleeding out of the paste does not arise. |
