| 摘要 |
<p>PURPOSE:To obtain an IC card related to the enhancement of productivity and the stability of quality by forming the conductive part piercing a spacer and a substrate in the thickness direction to be electrically connected to a conductive pattern through a contact surface. CONSTITUTION:A contact hole 18 is formed to the first over sheet 17 forming the surface of an IC card 15 and the rear of the card 15 is formed by the second over sheet 19 and a substrate 20 is inserted between the first and second over sheets 17, 19 and electronic parts 22 are inserted between the substrate 20 and the second over sheet 19. A spacer 25 is inserted in the contact hole 18 of the first over sheet 17 and the contact surface 16 and conductive pattern 21 formed to the surface thereof are electrically connected by the conductive part 28 pro vided in the through-hole 27 piercing the spacer 25 and the substrate 20. As a result, the difference in level between the surface of the first over sheet 17 and the contact surface 16 is extremely reduced and productivity is enhanced and the IC card of stable quality is obtained.</p> |
