| 摘要 |
PURPOSE:To obtain a solid-state image sensing device capable of being mass-produced with high yield by coating an inner lead with an Al film but not the positioning reference board nor an outer lead of a section exposed from a package body. CONSTITUTION:Sections CLD (inner leads IL and parts of reference board REE) represent regions in which Al films are applied selectively, and the regions are limited within a range not extruded from ceramic bodies UPP. That is, the blanks of regions PLT (outer leads OL and one parts of the reference boards REE) exposed from the ceramic bodies UPP are plated with Sn without interposing Al clad layers CLD. The Sn plated layers PLT are effective for preventing rust, and used for improving solderability at the time of mounting to an applier in the outer leads OL. Accordingly, specified wire-bonding strength is acquired, and the deterioration of picture quality, yield and reliability due to the peeling of Sn is prevented.
|
