| 摘要 |
PURPOSE:To efficiently perform wire junction by coating a conductor, connecting a semiconductor IC to the electrode of an electrode pad, with an insulating layer. CONSTITUTION:An IC2 is attached to the mounting part of a package 4, while an electrode pad of the IC2 performs wire jointing of the electrode of the package 4 with a metal wiring 3 coated with an insulating layer 5. A cap 1 seals it. Vinyl insulating layer is burnt by hydrogen gas flame to expose a metal wire which is then connected. Since an insulated wire is used, neighboring wires are not short-circuited even if they come in contact, and since no wire correction is required connection work can be carried out efficiently. |
