发明名称 WIRE BONDING
摘要 PURPOSE:To make possible a stable bonding regardless of the direction of a lead and the rigidity of the lead by a method wherein a timing of ultrasonic oscillation and an ultrasonic oscillation output are controlled. CONSTITUTION:A bonding tool 3 is made to vibrate by ultrasonic oscillation means 1, 14 and 15 and after the vibration of this tool 3 becomes a vibration of an amplitude larger than a proper amplitude for a bonding, this tool 3 is made to land on a lead 20b. Moreover, a wire 4 supported by the tool 3 is made to bond on the lead 20b in a state that it is made to vibrate in the proper amplitude. That is, as the tool 3 is landed on the lead 20b in a state that the amplitude of the tool 3 is larger than the proper amplitude for a bonding, the rise of ultrasonic vibration of the tool 3 to the lead 20b becomes infinite and the lead 20b can not follow up the vibration of the tool 3 and performs a relative movement. Thereby, a stable bonding can be made possible regardless of the direction of the lead and the rigidity of the lead.
申请公布号 JPH0391941(A) 申请公布日期 1991.04.17
申请号 JP19890229518 申请日期 1989.09.05
申请人 MITSUBISHI ELECTRIC CORP 发明人 OKAMURA MASAMITSU
分类号 H01L21/607;H01L21/60 主分类号 H01L21/607
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