| 摘要 |
PURPOSE: To dispense with the usage of adhesive by holding a component on one side face of a substrate at a proper place by soldering and soldering a component on the other side face. CONSTITUTION: The top of a surface-fixing land on the first side face of a printed circuit board is covered with soldering, a surface-mounting component is arranged on the land on the first side face, and the applied soldering is made to reflow. Next, the top of a surface-fixing land on the second side face of the printed circuit board and the inside of a plated through hole is covered with a solder, a surface-mounting component and a pin-in-hole component are arranged on the second side face, and all the solder on the printed substrate is made to reflow. Thereby the usage of adhesive is dispensed with in the assembling work of the printed circuit board with two side faces. |
