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经营范围
发明名称
Thermocompression bonding in integrated circuit packaging
摘要
申请公布号
US5006917(A)
申请公布日期
1991.04.09
申请号
US19890398799
申请日期
1989.08.25
申请人
INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人
KANG, SUNG K.;PALMER, MICHAEL J.;REILEY, TIMOTHY C.;TOPA, ROBERT D.
分类号
B23K20/02;B23K20/233;B23K33/00;H01L21/60;H01L21/603
主分类号
B23K20/02
代理机构
代理人
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地址
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