| 摘要 |
PURPOSE:To surely mount a semiconductor element on a heat sink in a predetermined position, prevent damage to a lead wire liable to occur during the mounting to a printed board and facilitate the mounting by using a container capable of receiving the semiconductor element kept in close contact with the heat sink and further having more than two mounting and supporting holes for the heat sink. CONSTITUTION:A semiconductor element 3 is mounted on a heat sink 5 in a predetermined position by means of a container 2 capable of receiving the semiconductor element 3 kept in close contact with the heat sink 5 and further having more than two mounting and supporting holes for the heat sink 5. For example, an HIC 3 is fixed to the heat sink 5 by means of the container (holder) 2 capable of receiving the HIC 3 kept in close contact with the heat sink 5 and provided with the mounting holes in the upper, right and left sides thereof for supporting the mounting positions of the heat sink. |
