发明名称 WIRE BONDING
摘要 PURPOSE:To obtain a method by which a crack of an object to be bonded is not caused by a shock and whose productivity is high by a method wherein the height of a face to be bonded is detected in advance, a motor is controlled in such a way that the falling speed of a bonding tool becomes zero when a wire comes into contact with the face to be bonded and, after that, the motor is driven again to apply a prescribed load. CONSTITUTION:In a wire bonding method which uses a bonding wire and a bonding tool 6, the height h0 of a face to be bonded to an object is detected in advance, and a motor 8 for bonding-tool raising and lowering drive use is controlled in such a way that the falling speed of the bonding tool 5 becomes zero when the bonding tool 5 and the bonding wire come into contact with the detected face to be bonded. After that, the motor 8 for bonding-tool raising and lowering drive use is driven again, and a prescribed bonding load is applied to the bonding tool 5. For example, the height h0 of the face to be bonded is detected by using a displacement sensor 11; after that, a prescribed bonding load is applied to a bonding tool 5 by means of a spring 10 for load setting use.
申请公布号 JPH0369129(A) 申请公布日期 1991.03.25
申请号 JP19890205927 申请日期 1989.08.08
申请人 NEC CORP 发明人 ONOZAWA TOSHIAKI;WATAKARI SATOSHI
分类号 H01L21/60 主分类号 H01L21/60
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