| 摘要 |
<p>PURPOSE:To obtain the subject tape giving excellent effect in cutting process of semiconductor wafer, etc., having specific tensile strength and elongation after irradiation with radioactive rays by providing a layer of a radiation-curing adhesive on a specific filmy supporting material. CONSTITUTION:A layer of a radiation-curing adhesive (2-50 mum thickness) containing 100 pts.wt. acrylic adhesive, 10-200 pts.wt. cyanurate compound or isocyanurate compound and 5-100 pts.wt. linear polyester or polyol-based urethane acrylate compound is provided on a filmy supporting material (30-300mum thickness) preferably composed of at least two resins having radiation permeability and tensile properties as >=1.2 ratio of 50% modulus to 25% modulus and <=70kg/cm<2> 25% modulus, then irradiated to afford the aimed tape having tensile properties as >=1.2 ratio of 50% modulus to 25% modulus and <=100kg/cm<2> 25% modulus.</p> |
