发明名称 |
RADIATION-POLYMERIZABLE MIXTURE AND PROCESS FOR PRODUCING A SOLDER RESIST MASK |
摘要 |
The present invention relates to a radiation- polymerizable mixture which includes a polymerizable compound, a polymeric binder which has units of methacrylic acid, a methacrylic acid ester and a styrene, the latter in a proportion of 40 to 65% by weight, a finely divided mineral pigment on a silicic acid or silicate basis, a photopolymerization initiator, a compound having at least two epoxy groups in its molecule and a thermal hardener for epoxy groups. The mixture is advantageous, in particular, for producing solder masks and can be cured after exposure to an image and development by heating to about 80 to 150.degree.C to form a stencil which is resistant under soldering conditions.
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申请公布号 |
CA2025831(A1) |
申请公布日期 |
1991.03.22 |
申请号 |
CA19902025831 |
申请日期 |
1990.09.20 |
申请人 |
HOECHST AKTIENGESELLSCHAFT |
发明人 |
EMMELIUS, MICHAEL;HERWIG, WALTER;ERBES, KURT;DECKER, RUDOLF |
分类号 |
G03F7/033;C08F257/02;C08F283/10;C08G59/00;C08G59/18;C08G59/40;C08K3/36;G03F1/08;G03F7/004;G03F7/031;G03F7/032;G03F7/038;H05K3/06;H05K3/28;(IPC1-7):G03F7/038;G03F7/40 |
主分类号 |
G03F7/033 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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