| 摘要 |
PURPOSE:To connect two semiconductor IC modules each other through a clip lead by fitting a lead in the shape of a circular ring into a throughhole of a wiring substrate for a semiconductor IC module to be electrically connected to the semiconductor IC module. CONSTITUTION:In order to connect two semiconductor IC modules 1 and 17 by a clip lead 11, a lead 12 in the shape of a circular ring is made to penetrate a side edge part throughhole of the semiconductor IC module 1 and a side edge part throughhole of the semiconductor IC module 17 for extension. This connection is so performed that the tip engaging parts 14a, 15a of the respective engaging pieces 14, 14 in the shape of a circular arc in an opened state are inserted through the side edge part throughholes of both semiconductor IC modules 1, 17 to make the respective engaging pieces 14, 15 in the shape of a circular arc to penetrate both throughholes followed by closing these engaging pieces 14, 15 in the shape of a circular arc for making the tip engaging parts 14a, 15a each other engaged. Thereby, the semiconductor IC module 17 for extension is connected to the semiconductor IC module 1 through the clip leads 11. |
