发明名称 |
Process for preparing polyamide film |
摘要 |
A process for preparing a polyamide type film which comprises melt-extruding a polyamide resin having a metal compound and a melt specific resistance of not more than 1.5x105 OMEGA cm at 260 DEG C. in a form of a film, contacting the melt-extruded film closely with a revolving cooling drum through static electricity and taking up the film while cooling rapidly to solidify, which provides remarkable improved adhesion by static electricity. As a result, increasing the take-up rate of the revolving cooling drum does not cause trapping of air between the drum and the film so that a film having excellent uniformity in thickness and transparency can be produced.
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申请公布号 |
US5000889(A) |
申请公布日期 |
1991.03.19 |
申请号 |
US19900489030 |
申请日期 |
1990.03.06 |
申请人 |
TOYO BOSEKI KABUSHIKI KAISHA |
发明人 |
HAMANO, AKITO;KUZE, KATSUAKI;TAKEUCHI, KUNIO;MATSUO, MAKI;SUZUKI, HAJIME;MAKIMURA, OSAMU;NAGAYASU, EIICHI |
分类号 |
B29C47/00;B29C47/88;B29C55/00 |
主分类号 |
B29C47/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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