| 摘要 |
<p>PURPOSE: To provide an integrated circuit package substrate having an expansion temperature coefficient matching that of a ceramic chip support by composing a core of a rigid solid graphite where hexagonal graphite crystallites are bonded through a pitch. CONSTITUTION: A heat sink substrate 6 arranged in the center comprises a core 23, conductive surface plates 13, 14, 15 and n inner bonding layer 24. A printed wiring board 4 is bonded to the heat sink substrate 6 through a second bonding layer 22. The printed wiring board 4 is provided, on the upper surface thereof, with a conductor run 25 connected electrically with an electronic device package 5 fixed on the plane having no lead wire. The substrate material includes a rigid graphite core 23, and copper-molybdenum-copper surface plates 13, 14, 15 fixed to the opposite planes of the core through Kepler/epoxy impregnated bonding layer. The core material is composed of rigid solid graphite where hexagonal graphite crystallites are bonded through a pitch.</p> |
