| 摘要 |
PURPOSE:To reduce line length and evade line sagging and bending at the time of resin sealing, by a method wherein, when an inner lead is connected with an electrode on a semiconductor chip via a bonding wire, bonding is performed in the state that the compression bonding surface of the bonding line is kept at angles of 90-140 deg. to the electrode on the inner Iead. CONSTITUTION:A semiconductor chip 1 mounted on an island 6, and inner leads 2 whose tip parts are bent upward at right angles are arranged on the periphery of the island 6. Electrodes formed on the surface of the chip 1 and the tips of the inner leads 2 are connected by using bonding wires. At this time, one end of the wire 3 is bonded with pressure on the horizontal surface of the electrode 5, and the other end is bonded with pressure on the vertical surface of the tip of the inner lead 2. Thereby the generation of cracks of a chip is evaded when a large-sized chip is sealed in a small sized package. |
