发明名称 IMPERVIOUSLY SEALED AND COMPACT ELECTRONIC MODULE
摘要 The module comprises a container (1) and electronic circuits placed inside the container, such that the container (1) is hermetically closed by a plug (2) comprising a conical slot through which passes a flexible flat strip (3) intended to provide the electrical connections between the electronic module and external devices, this slot being filled up by at least one plastic material (12, 13) resistant to hydrostatic pressure and having a good adhesion to the flat strip (3) and the walls of the plug (2) in order to seal the electronic module. <IMAGE>
申请公布号 AU6215790(A) 申请公布日期 1991.03.14
申请号 AU19900062157 申请日期 1990.09.04
申请人 THOMSON-CSF 发明人 NAME NOT GIVEN
分类号 H05K1/03;H05K1/14;H05K3/34;H05K3/40;H05K3/44;H05K5/00 主分类号 H05K1/03
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