| 摘要 |
PURPOSE:To easily impart an embossed pattern high in surface hardness to the surface of a resol type phenol resin foam plate without decreasing the strength of said foam plate by pressing a fiber reinforced phenol resin foam molded body by an embossing plate under pressure capable of collapsing the surface thereof while heating the same to the melting temp. of a thermoplastic resin. CONSTITUTION:A thermoplastic resin is added to a compound, which is prepared by adding a filler and a reinforcing fiber to a liquid resol type phenol resin, in an amount not reducing the matrix bonding strength of said phenol resin to mold a fiber reinforced phenol resin foam molded body. Subsequently, this molded body is pressed by an embossing plate under pressure capable of collapsing the surface thereof while heated to the melting temp. of the thermoplastic resin to form an embossed pattern surface excellent in strength to the surface of the molded body. |
