| 摘要 |
<p>PURPOSE:To obtain a board which can dissipate the heat generated by electronic parts outward directly from the base member mounting the electronic parts and mount the electronic parts with high density, by providing the base member which mounts the electronic parts and is constituted of ceramics material, and outer leading-out terminals fixed on the peripheral surface of the base member. CONSTITUTION:The title board is provided with the following; a base member 2 which mounts an electronic parts 1 and constituted of ceramics material, and outer leading-out terminals 6 which are fixed on the peripheral surface of the base member 2 and electrically connected with the electronic parts 1. For example, the base member 2 is formed in a rectangular type of aluminum nitride, and a thin film type conductor circuit 3 is formed on the upper surface of the periphery by physical deposition method. The electronic parts 1 is electrically connected with the conductor circuit 3 by using bonding wires 4. A cap 5 is mounted on the base member 2, with which the electronic parts 1, the conductor circuit 3, etc., are covered. The outer leading-out terminal 6 is made of conducting material and bent and formed, whose one end is connected with the conductor circuit 3 and fixed by soldering.</p> |
